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• Measurements taken on the prototype of a communications product showed that temperatures of critical
electronic components exceeded
design limits
• A Finite Element model of the prototype was created and included all significant heat sources, the
thermal conductivity properties of components, and convection boundary condition properties
considering the product's environment
• FE model predictions of steady-state temperatures at critical components matched customer's lab test
results and gave confidence that trade study results would also be accurate
• Ran trade studies to determine the most cost efficient means to dissipate heat
• Determined that the addition of thermal resin between the PC board and cover reduced steady-state
temperatures to acceptable levels
• The recommended solution saved the customer from expensive rework of the cover and cover tooling |
